BFN18
NPN Silicon High-Voltage Transistors
Data Sheet
Revision 1.0, 2010-10-13
RF & Protection Devices
Edition 2010-10-13
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2010 Infineon Technologies AG
All Rights Reserved.
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Information
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be endangered.
BFN18
Revision History
Page or Item
Subjects (major changes since previous revision)
Revision 1.0, 2010-10-13
Converted to the new IFX Template.
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™,
CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™,
EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™,
ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™,
PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SMARTi™,
SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™,
XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™,
REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership.
Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation
Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation.
FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of
Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of
INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of
Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP.
MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2010-06-09
Data Sheet
3
Revision 1.0, 2010-10-13
BFN18
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3
Characteristic DC Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4
Package Information SOT89 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Data Sheet
4
Revision 1.0, 2010-10-13
NPN Silicon High-Voltage Transistors
1
BFN18
Features
Main features:
•
•
•
•
•
•
Suitable for video output stages TV sets and switching power supplies
High breakdown voltage
Low collector-emitter saturation voltage
Complementary types: BFN19 (PNP)
Pb-free (RoHS compliant) package1)
Qualified according AEC Q101
SOT89-3D
1) Pb-containing package may be available upon special request
Product Name
Package
BFN18
SOT89
Data Sheet
Pin Configuration
1=B
2=C
7
3=E
Marking
4=C
DE
Revision 1.0, 2010-10-13
BFN18
Electrical Characteristics
2
Electrical Characteristics
Table 1
Absolute Maximum Ratings
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note / Test Condition
Collector-emitter voltage
VCEO
–
–
300
V
–
Collector-base voltage
VCBO
–
–
300
V
–
Emitter-base voltage
VEBO
–
–
5
V
–
Collector current
IC
–
–
200
mA
–
Peak collector current
ICM
–
–
500
mA
–
Base current
IB
–
–
100
mA
–
Peak base current
IBM
–
–
200
mA
–
Total power dissipationTS = 120 °C
Ptot
–
–
1.5
W
–
Junction temperature
Tj
–
–
150
°C
–
Storage temperature
Tstg
-65
–
150
°C
–
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the device.
Table 2
Thermal Resistance
Parameter
Symbol
Values
Min.
Typ.
1)
6
Note / Test Condition
K/W
–
Max.
Junction - soldering point
RthJS
–
–
≤ 20
1) For calculation of RthJA please refer to Application Note Thermal Resistance.
Data Sheet
Unit
Revision 1.0, 2010-10-13
BFN18
Electrical Characteristics
Table 3
DC Characteristics at TA = 25 °C, Unless Otherwise Specified
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Collector emitter breakdown voltage V(BR)CEO
300
–
–
V
IC = 1 mA, IB = 0
Collector-base breakdown voltage
V(BR)CBO
300
–
–
V
IC = 100 µA, IE = 0
Emitter-base breakdown voltage
V(BR)EBO
5
–
–
V
IE = 100 µA, IC = 0
Collector-base cutoff current
ICBO
–
–
0.1
µA
VCB = 250 V, IE = 0
–
–
20
IEBO
–
–
100
hFE
25
–
–
IC = 1 mA, VCE = 10 V
40
–
–
IC = 10 mA, VCE = 10 V
30
–
–
IC = 30 mA, VCE = 10 V
VCEsat
–
–
0.5
V
IC = 20 mA, IB = 2 mA
VBEsat
–
–
0.9
V
IC = 20 mA, IB = 2 mA
Emitter-base cutoff current
DC current gain
1)
1)
Collector-emitter saturation voltage
1)
Base emitter saturation voltage
1)Pulse test: t < 300 µs; D < 2%
Table 4
VCB = 250 V, IE = 0,
TA = 150°C
nA
VEB = 5 V, IC = 0
AC Characteristics at TA = 25 °C
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note / Test Condition
Transition frequency
fT
–
70
–
MHz
IC = 20 MHz, VCE = 10 V,
f = 20 MHz
Collector base capacitance
CCb
–
1.5
–
pF
VCB = 30 V, f = 1 MHz
Data Sheet
7
Revision 1.0, 2010-10-13
BFN18
Characteristic DC Diagrams
3
Characteristic DC Diagrams
DC Current Gain
hFE = f(IC), VCE = 10 V
10 3
Operating Range
IC = f(VCEO), TA = 25°C, D = 0
BFN 16/18
EHP00585
10 3
BFN 16/18
EHP00580
mA
5
ΙC
h FE
10 μ s
10 2
5
10 2
100 μ s
1ms
100 ms
5
10 1
5
10
DC
1
10 0
5
5
10 0
-1
10
5 10
0
5 10
1
2
5 10 mA 10
ΙC
10 -1
10 0
3
5 10 2
V 5 10 3
V CEO
Collector Current
Collector Cutoff Current
ICBO = f(TA), VCBO = 200 V
IC = f(VBE), VCE = 10 V
10 3
5 10 1
BFN 16/18
EHP00582
10 4
nA
mA
ΙC
Ι CBO
10 2
BFN 16/18
EHP00584
max
10 3
5
5
10 2
5
10 1
5
typ
10 1
5
10 0
10 0
5
5
10 -1
0
0.5
10 -1
V 1.5
1.0
50
˚C
100
150
TA
V BE
Data Sheet
0
8
Revision 1.0, 2010-10-13
BFN18
Characteristic DC Diagrams
Collector Base Capacitance Ccb = f(VCB)
Emitter Base Capacitance Ceb = f(VEB)
Transition Frequency
fT = f(IC), VCE = 10 V
10 3
BFN 16/18
EHP00583
90
80
fT
MHz
70
10
Ccb, Ceb [pF]
60
2
5
50
Ceb
40
30
20
10
Ccb
10 1
10 0
5 10 1
5
0
10 2 mA 5 10 3
ΙC
0
5
10
15
25
Permissible Pulse Load
Ptotmax / PtotDC = f(TS)
Total Power Dissipation
Ptot = f(TS)
10 3
2
BFN 16/18
Ptot max
5
Ptot DC
1.8
EHP00581
D=
1.6
tp
tp
T
T
1.4
10 2
D=
0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
1.2
Ptot [W]
20
Vcb, Veb [V]
5
1
0.8
10 1
0.6
5
0.4
0.2
0
0
50
100
10 0
10 -6
150
Ts [°C]
Data Sheet
10 -5
10 -4
10 -3
10 -2
s
10 0
tp
9
Revision 1.0, 2010-10-13
BFN18
Package Information SOT89
4
Package Information SOT89
4.5 ±0.1
45˚
B
1.5 ±0.1
0.2 MAX.
2
2.75 +0.1
-0.15
3
1.5
0.35 ±0.1
0.45 +0.2
-0.1
3
0.15
M
B x3
0.2 B
1) Ejector pin markings possible
Figure 1
1.6 ±0.2
1±0.2
1
1)
0.15
4 ±0.25
1±0.1
1)
2.5±0.1
0.25 ±0.05
SOT89-PO V02
Package Outline
1.2
1.0
2.5
2.0
0.8
0.8
0.7
SOT89-FP V02
Figure 2
Package Foot Print
BAW78D
Type code
GA
Pin 1
S 56
2005, June
Date code (YM)
Manufacturer
SOT 89 -M A.vsd
Figure 3
Data Sheet
Marking Example
10
Revision 1.0, 2010-10-13
BFN18
Package Information SOT89
Pin 1
4.3
12
4.6
8
1.6
SOT89-TP V02
Figure 4
Tape Dimensions
Packing Description
Reel Ø180 mm = 1.000 Pieces/Reel
Reel Ø330 mm = 4.000 Pieces/Reel
Data Sheet
11
Revision 1.0, 2010-10-13
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